Patent Assignment
Reel/Frame 051069/0798
Assignment of Assignor's Interest
Recorded: 2019-11-20
Pages: 8
Assignors
YONG, KHANG CHOONG
Executed: 2019-04-23
GOH, ENG HUAT
Executed: 2019-04-23
LIM, MIN SUET
Executed: 2019-04-23
SANKMAN, ROBERT
Executed: 2019-04-19
KAMGAING, TELESPHOR
Executed: 2019-04-23
SONG, WIL CHOON
Executed: 2019-04-23
KOH, BOON PING
Executed: 2019-04-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Disaggregated Die Interconnection with on-Silicon Cavity Bridge