Patent Assignment
Reel/Frame 051080/0337
Assignment of Assignor's Interest
Recorded: 2019-11-21
Pages: 4
Assignors
GAO, GUILIAN
Executed: 2019-09-17
UZOH, CYPRIAN EMEKA
Executed: 2019-09-18
THEIL, JEREMY ALFRED
Executed: 2019-09-17
HABA, BELGACEM
Executed: 2019-09-23
KATKAR, RAJESH
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Molded Direct Bonded and Interconnected Stack
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Aug 18, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 064650/0018 →
Change of Name
Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →