Patent Assignment
Reel/Frame 051085/0172
Assignment of Assignor's Interest
Recorded: 2019-11-22
Pages: 6
Assignors
MALLIK, DEBENDRA
Executed: 2019-05-23
MAHAJAN, RAVINDRANATH
Executed: 2019-05-23
SANKMAN, ROBERT
Executed: 2019-05-29
LIFF, SHAWNA
Executed: 2019-05-23
PIETAMBARAM, SRINIVAS
Executed: 2019-05-23
PENMECHA, BHARAT
Executed: 2019-05-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Heterogeneous Nested Interposer Package for Ic Chips