Heterogeneous nested interposer package for IC chips
Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.
1. An electronic package, comprising:
an interposer, wherein a cavity passes through the interposer;
a nested component in the cavity; and
a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect, wherein the first and second interconnects comprise:
a first bump;
a bump pad over the first bump; and
a second bump over the bump pad.
2. The electronic package of claim 1 , wherein the bump pad of the first interconnect is substantially coplanar to the bump pad of the second interconnect.
3. The electronic package of claim 1 , wherein the nested component and the interposer are embedded in an underfill layer and a first mold layer.
4. The electronic package of claim 3 , wherein the die is embedded in a second mold layer.
5. The electronic package of claim 1 , wherein the cavity is entirely within a footprint of the die.
6. The electronic package of claim 1 , wherein a first portion of the cavity is within a footprint of the die, and wherein a second portion of the cavity is outside of the footprint of the die.
7. The electronic package of claim 1 , wherein through component vias extend through the nested component.
8. The electronic package of claim 1 , wherein the nested component is a passive component.
9. The electronic package of claim 1 , wherein the nested component is an active component.
10. The electronic package of claim 1 , further comprising:
a second die, wherein the second die is coupled to the nested component by a third interconnect comprising:
a first bump;
a bump pad over the first bump; and
a second bump over the bump pad.
11. The electronic package of claim 10 , wherein the nested component electrically couples the first die to the second die.
12. The electronic package of claim 1 , further comprising:
a second nested component in the cavity.
13. The electronic package of claim 1 , wherein an active surface of the nested component faces away from the die.
14. The electronic package of claim 1 , wherein the nested component comprises a plurality of stacked dies.
15. The electronic package of claim 1 , wherein the interposer comprises a plurality of discrete interposer substrates, wherein edges of the plurality of discrete interposer substrates define the cavity.
16. The electronic package of claim 1 , wherein the interposer comprises glass, ceramic, silicon, or organic materials.
17. The electronic package of claim 1 , further comprising one or more redistribution layers, wherein the one or more redistribution layers are located over a top surface of the interposer, over a bottom surface of the interposer, over a top surface of the nested component, over a bottom surface of the nested component, over a mold layer that embeds the interposer and the nested component, and/or between the first bumps and the second bumps.
18. An electronic system, comprising:
a board;
a package substrate electrically coupled to the board;
an interposer electrically coupled to the package substrate, wherein the interposer comprises a cavity;
a nested component in the cavity, wherein the nested component is electrically coupled to the package substrate;
a first die electrically coupled to the interposer and the nested component by first interconnects; and
a second die electrically coupled to the interposer and the nested component by second interconnects, wherein each of the first interconnects and each of the second interconnects:
a first bump;
a bump pad over the first bump; and
a second bump over the bump pad.
19. The electronic system of claim 18 , wherein the nested component electrically couples the first die to the second die.
20. The electronic system of claim 18 , wherein the nested component is a passive component.
21. The electronic system of claim 18 , wherein the nested component is an active component.
22. The electronic system of claim 18 , wherein the nested component comprises a plurality of stacked dies.