Patent Assignment
Reel/Frame 051090/0328
Assignment of Assignor's Interest
Recorded: 2019-11-22
Pages: 2
Assignors
KUO, HUNG-JUI
Executed: 2019-11-01
WANG, CHIA-WEI
Executed: 2019-11-01
TSAI, HUI-JUNG
Executed: 2019-11-01
CHANG, YU-TZU
Executed: 2019-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method