Patent Assignment
Reel/Frame 051095/0582
Assignment of Assignor's Interest
Recorded: 2019-11-22
Pages: 3
Assignor
SATO, HIROAKI
Executed: 2019-11-14
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Multi-Layer Ceramic Electronic Component, Multi-Layer Ceramic Electronic Component Mounting Substrate, Multi-Layer Ceramic Electronic Component Package, and Method of Producing a Multi-Layer Ceramic Electronic Component