Patent Assignment
Reel/Frame 051098/0611
Assignment of Assignor's Interest
Recorded: 2019-11-24
Pages: 3
Assignor
HIGASHISAKA, HIROYOSHI
Executed: 2019-11-18
Assignee
SHARP KABUSHIKI KAISHA
1, TAKUMI-CHO, SAKAI-KU, SAKAI CITY, OSAKA, JAPAN
Covered Property
(1)
Semiconductor Module and Method for Manufacturing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.