Patent Assignment
Reel/Frame 051098/0888
Assignment of Assignor's Interest
Recorded: 2019-11-24
Pages: 5
Assignors
HUANG, SHIH-YA
Executed: 2019-10-28
TSAI, CHUNG-HAO
Executed: 2019-10-25
YU, CHEN-HUA
Executed: 2019-10-28
WANG, CHUEI-TANG
Executed: 2019-10-28
CHANG, CHIH-YUAN
Executed: 2019-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof