Patent Assignment
Reel/Frame 051105/0037
Assignment of Assignor's Interest
Recorded: 2019-11-25
Pages: 8
Assignors
TAKADA, RYOSUKE
Executed: 2019-11-22
HAYASHI, TOSHITAKA
Executed: 2019-11-20
KOYAMA, HIROMASA
Executed: 2019-11-20
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Multilayer Wiring Board, Electronic Device and Method for Producing Multilayer Wiring Board