Patent Assignment
Reel/Frame 051106/0201
Assignment of Assignor's Interest
Recorded: 2019-11-25
Pages: 3
Assignor
TADAYON, POOYA
Executed: 2019-07-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Double-Sided Substrate with Cavities for Direct Die-to-Die Interconnect