Patent Assignment
Reel/Frame 051111/0012
Assignment of Assignor's Interest
Recorded: 2019-11-25
Pages: 6
Assignors
BRUN, XAVIER F.
Executed: 2019-07-30
MISTRY, KAIZAD
Executed: 2019-08-15
START, PAUL R.
Executed: 2019-07-30
ANANTHAKRISHNAN, NISHA
Executed: 2019-07-31
LIANG, YAWEI
Executed: 2019-07-30
PATEL, JIGNESHKUMAR P.
Executed: 2019-07-30
AGRAHARAM, SAIRAM
Executed: 2019-08-01
WANG, LIWEI
Executed: 2019-08-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Level Passive Heat Spreader Interposer to Enable Improved Thermal Solution for Stacked Dies in Multi-Chips Package and Warpage Control
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.