Patent Assignment
Reel/Frame 051116/0725
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 3
Assignors
PAITAL, SAMEER
Executed: 2019-11-21
DUAN, GANG
Executed: 2019-11-21
PIETAMBARAM, SRINIVAS
Executed: 2019-11-21
DARMAWIKARTA, KRISTOF
Executed: 2019-11-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method to Form High Capacitance Thin Film Capacitors (Tfcs) as Embedded Passives in Organic Substrate Packages