Patent Assignment
Reel/Frame 051117/0738
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 7
Assignors
LEE, HEON BOK
Executed: 2019-11-09
KIM, DAE YONG
Executed: 2019-11-06
KIM, WAN DON
Executed: 2019-11-08
YIM, JEONG HYUK
Executed: 2019-11-11
CHUNG, WON KEUN
Executed: 2019-11-11
CHOI, HYO SEOK
Executed: 2019-11-13
HYUN, SANG JIN
Executed: 2019-11-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same