Patent Assignment
Reel/Frame 051124/0142
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 6
Assignees
SENJU METAL INDUSTRY CO., LTD.
23, SENJU, HASHIDO-CHO,, ADACHI-KU, TOKYO, 120-8555, JAPAN
SENJU SYSTEM TECHNOLOGY CO., LTD.
1-4, FUCHUMACHISHIMAHONGO,, TOYAMA-SHI, TOYAMA, 939-2708, JAPAN
Covered Property
(1)
Soldering Method and Soldering Apparatus