Patent Assignment
Reel/Frame 051124/0955
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 3
Assignors
HSIEH, TSUNG-MIN
Executed: 2019-11-01
TSAI, CHENG-WEI
Executed: 2019-11-01
LEE, CHIEN-HSING
Executed: 2019-11-01
Assignee
SOLID STATE SYSTEM CO., LTD.
5F-1, NO. 22, TAIYUEN STREET, JUBEI CITY,, HSINCHU, 302, TAIWAN
Covered Property
(1)
Structure of Micro-Electro-Mechanical-System Microphone and Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.