Patent Assignment
Reel/Frame 051124/0990
Assignment of Assignor's Interest
Recorded: 2019-11-26
Pages: 4
Assignors
HUANG, WEN HUNG
Executed: 2019-11-18
CHUNG, YAN WEN
Executed: 2019-11-18
HUANG, MIN LUNG
Executed: 2019-11-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same