Patent Assignment
Reel/Frame 051126/0181
Assignment of Assignor's Interest
Recorded: 2019-11-27
Pages: 3
Assignor
SASAKI, TAKASHI
Executed: 2019-11-18
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Multi-Layer Ceramic Electronic Component, Method of Producing a Multi-Layer Ceramic Electronic Component, and Substrate with a Built-in Electronic Component