Patent Assignment
Reel/Frame 051129/0833
Assignment of Assignor's Interest
Recorded: 2019-11-27
Pages: 3
Assignors
SHEN, HSIANG-KU
Executed: 2019-11-14
CHEN, YING-JU
Executed: 2019-11-14
CHEN, HSIEN-WEI
Executed: 2019-11-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packaging Scheme Involving Metal-Insulator-Metal Capacitor