IP Library Assignment 051131/0730
Patent Assignment
Reel/Frame 051131/0730

Assignment of Assignor's Interest

Recorded: 2019-11-27 Pages: 5
Assignors
DESALVO, DONALD
Executed: 2019-11-26
BLAKE, RON
Executed: 2019-11-22
GUGLIOTTI, CARMICHAEL
Executed: 2019-11-22
DECESARE, WILLIAM J.
Executed: 2019-11-22
BELLEMARE, RICHARD
Executed: 2019-11-22
Assignee
MACDERMID ENTHONE INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Property (1)
Single Step Electrolytic Method of Filling Through Holes in Printed Circuit Boards and Other Substrates
Application: 16/674,052 →
Publication: US 2021/0130970