Patent Assignment
Reel/Frame 051148/0678
Assignment of Assignor's Interest
Recorded: 2019-12-02
Pages: 4
Assignors
CHI, SHIN
Executed: 2019-10-28
HSU, CHIEN-HAO
Executed: 2019-10-28
CHANG, KUO-CHIN
Executed: 2019-10-28
LIN, CHENG-NAN
Executed: 2019-10-28
LII, MIRNG-JI
Executed: 2019-10-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Chip Package Structure with Heat Conductive Layer