Patent Assignment
Reel/Frame 051152/0246
Assignment of Assignor's Interest
Recorded: 2019-12-02
Pages: 4
Assignors
GARNER, SEAN MATTHEW
Executed: 2018-05-21
HUANG, TIAN
Executed: 2018-05-18
PETRIWSKY, TAMMY LYNN
Executed: 2018-05-24
Assignee
CORNING INCORPORATED
SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Assembly Substrates Including Through Hole Vias and Methods for Making Such