Patent Assignment
Reel/Frame 051163/0190
Assignment of Assignor's Interest
Recorded: 2019-12-03
Pages: 6
Assignors
WATAMURA, KENJI
Executed: 2019-11-28
KAMINAGA, JUN
Executed: 2019-11-20
KOMIYAMA, HIROHIDE
Executed: 2019-11-22
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN #02-01, NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Electronic Device with Reduced Chassis Thickness
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.