IP Library Granted Patent US 11,281,265
Granted Patent B2
US 11,281,265 · App. 16/701,733 · Granted Mar 22, 2022

Electronic device with reduced chassis thickness

Inventors: Kenji Watamura (Yokohama, JP); Jun Kaminaga (Tokyo, JP); Hirohide Komiyama (Yokohama, JP)
Assignee: LENOVO (SINGAPORE) PTE. LTD.
G06F1/20G06F1/1616G06F1/1662H05K1/0203H05K1/0277H05K1/14H05K1/181H05K7/20136
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Quick Facts
Patent No.
US 11,281,265
App. No.
16/701,733
Granted
Mar 22, 2022
Kind
B2
Abstract

An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.

Claims (49)

1. An electronic device comprising:

a substrate on which an electronic component is mounted;

an expansion card disposed at an interval from the substrate;

a flexible printed circuit electrically connecting the substrate and the expansion card;

a connector in the flexible printed circuit and to which a terminal of the expansion card is connected;

a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member;

the entire heat transport member lies only lateral to the cooling fan;

a bracket fixed to the connector;

a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, wherein

the cooling fan is between the substrate and the expansion card, and overlaps the flexible printed circuit, and

the bracket is fixed to the chassis;

wherein the expansion card is configured to provide an optional capability to the electronic device such that the cooling fan is operable even when the expansion card is disconnected from the connector.

2. The electronic device according to claim 1 , wherein

the bracket has:

a bottom bracket between the connector and the chassis, and is fixed to the chassis; and

a top bracket holds the connector between the top bracket and the bottom bracket.

3. The electronic device according to claim 2 , wherein

the top bracket is fixed to the bottom bracket.

4. The electronic device according to claim 2 , wherein

the bottom bracket has:

a pedestal portion on which a part of the flexible printed circuit is placed; and

a positioning portion positions the bottom bracket and the flexible printed circuit.

5. The electronic device according to claim 1 , wherein

the expansion card is fixed to the bracket in a portion other than the terminal of the expansion card.

6. The electronic device according to claim 1 , wherein

the chassis has a keyboard,

the keyboard has:

a plurality of keys; and

a back plate supporting the plurality of keys, and

the bracket is fixed to the back plate.

7. The electronic device according to claim 6 , wherein

the flexible printed circuit is fixed to the back plate with a double-sided tape.

8. The electronic device according to claim 1 , further comprising:

a plurality of sets of the expansion card and the connector, and which are connected to the flexible printed circuit.

9. The electronic device according to claim 8 , wherein

a number of the flexible printed circuit is one, and

the flexible printed circuit electrically connects the plurality of sets and the substrate.

10. The electronic device according to claim 1 , wherein the cooling fan is disposed on a same plane as the substrate and the expansion card.

11. An electronic device comprising:

a substrate on which an electronic component is mounted;

an expansion card disposed at an interval from the substrate;

a flexible printed circuit electrically connecting the substrate and the expansion card;

a connector is in the flexible printed circuit and to which a terminal of the expansion card is connected;

a cooling unit having a heat transport member thermally connected to the electronic component, and a cooling fan cooling the heat transport member;

the entire heat transport member lies only lateral to the cooling fan; and

a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, and the cooling unit, wherein

the cooling fan is between the substrate and the expansion card, and overlaps the flexible printed circuit;

wherein the expansion card is configured to provide an optional capability to the electronic device such that the cooling fan is operable even when the expansion card is disconnected from the connector.

12. The electronic device according to claim 11 , wherein the cooling fan is disposed on a same plane as the substrate and the expansion card.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2025
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 070269/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2019
From: WATAMURA, KENJI; KAMINAGA, JUN; KOMIYAMA, HIROHIDE
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 051163/0190 →
Priority Claims (1)
JP JP2019-173986 · Sep 25, 2019 · national
Continuity (1)
Related Publication 20210089094A1 · Mar 25, 2021