Patent Assignment
Reel/Frame 051177/0404
Assignment of Assignor's Interest
Recorded: 2019-12-04
Pages: 5
Assignors
YEO, YEE-CHIA
Executed: 2017-01-23
WANG, SUNG-LI
Executed: 2017-01-16
CHUI, CHI ON
Executed: 2017-01-16
SHEU, JYH-CHERNG
Executed: 2017-01-16
CHIANG, HUNG-LI
Executed: 2017-01-16
CHEN, I-SHENG
Executed: 2017-01-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof