Patent Assignment
Reel/Frame 051179/0397
Assignment of Assignor's Interest
Recorded: 2019-12-04
Pages: 7
Assignors
CHOI, GYUJIN
Executed: 2019-10-01
KIM, SUNGHOAN
Executed: 2019-10-01
JOO, CHANGEUN
Executed: 2019-10-01
KWON, CHILWOO
Executed: 2019-10-01
LIM, YOUNGKYU
Executed: 2019-10-01
LEE, SUNGUK
Executed: 2019-10-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Connection Structure of Semiconductor Chip and Method of Manufacturing Semiconductor Package