Patent Assignment
Reel/Frame 051193/0347
Assignment of Assignor's Interest
Recorded: 2019-12-05
Pages: 3
Assignee
PINK GMBH THERMOSYSTEME
AM KESSLER 6, WERTHEIM, 97877, GERMANY
Covered Property
(1)
Soldering Device and a Method for Producing a Solder Connection of Components Using Adhesive Material for Temporary Connection of the Components