Patent Assignment
Reel/Frame 051193/0463
Assignment of Assignor's Interest
Recorded: 2019-12-05
Pages: 8
Assignors
LIN, HSING-LIEN
Executed: 2019-10-04
WU, CHII-MING
Executed: 2019-11-17
TRINH, HAI-DANG
Executed: 2019-10-04
JIANG, FA-SHEN
Executed: 2019-10-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Diffusion Barrier Layer in Top Electrode to Increase Break Down Voltage