Patent Assignment
Reel/Frame 051205/0225
Assignment of Assignor's Interest
Recorded: 2019-12-06
Pages: 7
Assignors
PARK, DAEHYEONG
Executed: 2019-12-06
CHOI, JONGMIN
Executed: 2019-12-06
KIM, JAEHEE
Executed: 2019-12-06
KIM, JONGKEUN
Executed: 2019-12-06
KIM, HUN
Executed: 2019-12-06
BYUN, DONGHYUN
Executed: 2019-12-06
JEONG, UYHYEON
Executed: 2019-12-06
JUNG, IKSU
Executed: 2019-12-06
CHO, SUNGGUN
Executed: 2019-12-06
CHO, CHONGKUN
Executed: 2019-12-06
CHOI, WONHEE
Executed: 2019-12-06
HWANG, SEUNGHYUN
Executed: 2019-12-06
YOON, BYOUNGUK
Executed: 2019-12-06
LEE, MINSUNG
Executed: 2019-12-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device with Bonding Structure