Patent Assignment
Reel/Frame 051213/0523
Assignment of Assignor's Interest
Recorded: 2019-12-06
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2019-11-12
WANG, CHUEI-TANG
Executed: 2019-11-12
CHEN, CHIEH-YEN
Executed: 2019-11-12
CHANG, WEI LING
Executed: 2019-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method