Patent Assignment
Reel/Frame 051221/0563
Assignment of Assignor's Interest
Recorded: 2019-12-09
Pages: 4
Assignors
HSIEH, SHENG-CHI
Executed: 2019-08-21
WANG, CHEN-CHAO
Executed: 2019-09-04
LEE, TECK-CHONG
Executed: 2019-09-04
CHEN, CHIEN-HUA
Executed: 2019-09-04
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same