Patent Assignment
Reel/Frame 051252/0218
Assignment of Assignor's Interest
Recorded: 2019-12-11
Pages: 4
Assignor
PARK, YOUNGWOO
Executed: 2019-11-19
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including an Electromagnetic Shield and Method of Fabricating the Same