Patent Assignment
Reel/Frame 051261/0290
Assignment of Assignor's Interest
Recorded: 2019-12-12
Pages: 8
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2018-06-04
WANG, HUNG CHO
Executed: 2018-06-04
TSAI, JIUNYU
Executed: 2018-06-04
HUANG, SHENG-HUANG
Executed: 2018-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Techniques for Mram Mtj Top Electrode to Metal Layer Interface Including Spacer