Patent Assignment
Reel/Frame 051271/0843
Assignment of Assignor's Interest
Recorded: 2019-12-13
Pages: 4
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WENCHANG RD., ECONOMIC TECHNOLOGICAL DEVELOPMENT AREA, BEIJING, 100176, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Method for Forming a Fin-Based Semiconductor Structure