Patent Assignment
Reel/Frame 051297/0576
Assignment of Assignor's Interest
Recorded: 2019-12-16
Pages: 4
Assignors
LIN, CHIH-HAO
Executed: 2019-12-03
CHANG, CHIEN-KUO
Executed: 2019-12-03
LEE, PU-SHENG
Executed: 2019-12-03
LI, FU-JEN
Executed: 2019-12-03
MENG, HSIEN-LIANG
Executed: 2019-12-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages with Multi-Thermal Interface Materials and Methods of Fabricating the Same