Patent Assignment
Reel/Frame 051311/0045
Assignment of Assignor's Interest
Recorded: 2019-12-17
Pages: 4
Assignors
CHEN, HSIN-EN
Executed: 2019-12-11
HU, IAN
Executed: 2019-12-11
TSAI, JUNG-CHE
Executed: 2019-12-11
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Electronic Device