Patent Assignment
Reel/Frame 051311/0054
Assignment of Assignor's Interest
Recorded: 2019-12-17
Pages: 5
Assignors
CHAN, YA FANG
Executed: 2019-12-12
CHIANG, YUAN-FENG
Executed: 2019-12-12
LU, PO-WEI
Executed: 2019-12-12
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method of Manufacturing the Same