Patent Assignment
Reel/Frame 051312/0654
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 12
Assignors
OH, DUCK-MAHN
Executed: 2019-06-25
KIM, JONG-AN
Executed: 2019-07-02
SOHN, YOUNG-HOON
Executed: 2019-06-25
YANG, YU-SIN
Executed: 2019-06-25
LEE, CHI-HOON
Executed: 2019-07-09
CHOI, SI-HYEON
Executed: 2019-07-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods for Nondestructive Measurements of Thickness of Underlying Layers