Patent Assignment
Reel/Frame 051315/0317
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 3
Assignors
CHEN, CHIH-LIN
Executed: 2018-06-19
LIU, CHIN-CHOU
Executed: 2018-07-03
CHANG, FONG-YUAN
Executed: 2018-06-19
LEE, HUI-YU
Executed: 2018-06-19
HUANG, PO-HSIANG
Executed: 2018-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit Including a First Semiconductor Wafer and a Second Semiconductor Wafer, Semiconductor Device Including a First Semiconductor Wafer and a Second Semiconductor Wafer and Method of Manufacturing Same