Patent Assignment
Reel/Frame 051319/0526
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 7
Assignors
LEE, JAEHYUN
Executed: 2019-10-25
LEE, JONGHAN
Executed: 2019-10-25
PARK, SEONGHWA
Executed: 2019-10-25
PARK, JONGHA
Executed: 2019-10-25
WOO, JAEHOON
Executed: 2019-10-25
JEONG, DABOK
Executed: 2019-10-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Semiconductor Device and Method of Manufacturing the Same