Patent Assignment
Reel/Frame 051326/0345
Assignment of Assignor's Interest
Recorded: 2019-12-18
Pages: 4
Assignors
TSENG, TING-CHEN
Executed: 2019-12-09
KUO, HUNG-JUI
Executed: 2019-12-09
HU, YU-HSIANG
Executed: 2019-12-09
LIAO, SIH-HAO
Executed: 2019-12-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Solder Resist Underlayer for Warpage Control and Method of Manufacturing the Same