Patent Assignment
Reel/Frame 051333/0677
Assignment of Assignor's Interest
Recorded: 2019-12-19
Pages: 4
Assignors
CHANG, YU-JEN
Executed: 2017-09-18
HSIEH, MIN-YANN
Executed: 2017-09-20
CHEN, HUA FENG
Executed: 2017-09-20
PAN, KUO-HUA
Executed: 2017-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.