Patent Assignment
Reel/Frame 051337/0981
Assignment of Assignor's Interest
Recorded: 2019-12-19
Pages: 4
Assignors
LIN, TZU-HUNG
Executed: 2012-12-07
HSU, WEN-SUNG
Executed: 2012-12-07
YU, TA-JEN
Executed: 2012-12-07
CHANG, ANDREW C.
Executed: 2012-12-07
Assignee
MEDIATEK, INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU 300, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Fabricating Base for Semiconductor Package