Patent Assignment
Reel/Frame 051338/0706
Assignment of Assignor's Interest
Recorded: 2019-12-19
Pages: 3
Assignor
CHANG, CHIH YUAN
Executed: 2019-12-19
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Wafer-Level Stacked Die Structures and Associated Systems and Methods