IP Library Assignment 051352/0467
Patent Assignment
Reel/Frame 051352/0467

Assignment of Assignor's Interest

Recorded: 2019-12-23 Pages: 6
Assignors
LIU, KUAN-LIANG
Executed: 2019-11-11
TU, YEUR-LUEN
Executed: 2019-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor-On-Insulator Wafer Having a Composite Insulator Layer
Application: 16/580,259 →
Publication: US 2021/0091118