Patent Assignment
Reel/Frame 051353/0195
Assignment of Assignor's Interest
Recorded: 2019-12-23
Pages: 10
Assignors
HWANG, HEEJUNG
Executed: 2019-10-08
KIM, JAE CHOON
Executed: 2019-12-02
CHOI, YUN SEOK
Executed: 2019-10-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Thermal Pillar and Heat Transfer Film