Patent Assignment
Reel/Frame 051360/0274
Assignment of Assignor's Interest
Recorded: 2019-12-23
Pages: 6
Assignors
LIN, CHIA-MIN
Executed: 2019-11-22
HSIEH, CHING-HUA
Executed: 2019-11-22
LIN, CHIH-WEI
Executed: 2019-11-25
CHIU, SHENG-HSIANG
Executed: 2019-11-22
WENG, SHENG-FENG
Executed: 2019-11-25
LAI, YAO-TONG
Executed: 2019-11-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit Structures and Methods of Forming the Same