Patent Assignment
Reel/Frame 051361/0467
Merger
Recorded: 2019-12-24
Pages: 12
Assignor
MSTAR SEMICONDUCTOR, INC.
Executed: 2019-01-24
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Circuit Board and Packaged Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.