Patent Assignment
Reel/Frame 051367/0303
Assignment of Assignor's Interest
Recorded: 2019-12-26
Pages: 6
Assignors
KWON, YOO-JEONG
Executed: 2019-12-05
YUN, JINSEONG
Executed: 2019-12-05
LEE, KYUDONG
Executed: 2019-12-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Modules Including Power Management Integrated Circuits