Patent Assignment
Reel/Frame 051374/0361
Assignment of Assignor's Interest
Recorded: 2019-12-27
Pages: 4
Assignors
SU, YI-NIEN
Executed: 2019-07-23
SUEN, SHU-HUEI
Executed: 2019-07-23
SHIEH, JYU-HORNG
Executed: 2019-07-23
LIU, RU-GUN
Executed: 2019-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Device