Patent Assignment
Reel/Frame 051376/0197
Assignment of Assignor's Interest
Recorded: 2019-12-27
Pages: 3
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Multi-Layer Substrate and Method for Manufacturing Multi-Layer Substrate